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 SAE Home > Products & Services > Material Science Lab > Surface Analysis Laboratory
Surface Analysis Laboratory Cleanliness Lab Polymer Lab Environmental Lab RoHS Lab ESD Lab Failure Lab
In HDD, Semiconductor industries and micro electronic devices fields, organic and inorganic contaminants may induce corrosion, scratch, and adhesion and break short issues, which affect the product performance and reliability. MSL have the capabilities and rich experiences to perform cleanliness testing of electronic components. In order to ensure that we meet the stringent cleanliness specification required by the electronic industries, we have established a systematic quality control system to achieve high accuracy and high precision. The services include: cleanliness test and evaluation for incoming and products; providing complete analysis techniques and solution for micro contamination control.
 

JEOL JEM2100F TEM (with EDS /EELS)

PHI-680 FE Auger Nano Probe

  分析技术手段 Testing techniques
  • 俄歇纳米探针系统(PHI-680 FE AES)
  • 飞行时间二次离子质谱仪 (PHI TRIFT-II TOF-SIMS)
  • 扫描电子显微镜 (JSM-6700 FE-SEM)
  • 超级扫描电子显微镜 (Hitachi S-5200 Super-SEM)
  • 能量色散谱仪 (JSM-6301 SEM/EDX )
  • 透射电子显微镜 (JEOL JEM2100F TEM / X-24063JGT EDS / Gatan 794 EELS)
  • 原子力显微镜 (Digital DI 3100 SPM)
  • 聚焦离子束(FEI-200 THP, SII SMI 3050MS2)
  • 精细研磨设备(Centar Next-1 TPS-4000 lapping System)
AFMSuper-SEMFIBFE-SEM
服务范围 Services
  • 材料表征和表面成份分析,纳米级到微米级(Material characterization & Surface analysis, sub-nanometer~ sub-micrometer)
  • 界面扩散分析 (Diffusion at the interface)
  • 表面腐蚀分析 (Surface Corrosion)
  • 表面搀杂改性分析 (Surface Dopants)
  • 失效分析 (Failure analysis)
  • 表面形貌分析 (Morphology & Topography)
  • 薄膜分析 (Thin film analysis)
  • 表面污染物分析 (Cleanliness analysis)
  • 镀层厚度和成份分析 (Plating thickness & composition)

PHI TRIFT-II TOF-SIMS

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