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In HDD, Semiconductor industries and micro electronic devices fields, organic and inorganic contaminants may induce corrosion, scratch, and adhesion and break short issues, which affect the product performance and reliability. MSL have the capabilities and rich experiences to perform cleanliness testing of electronic components. In order to ensure that we meet the stringent cleanliness specification required by the electronic industries, we have established a systematic quality control system to achieve high accuracy and high precision. The services include: cleanliness test and evaluation for incoming and products; providing complete analysis techniques and solution for micro contamination control.
JEOL JEM2100F TEM (with EDS /EELS)

PHI-680 FE Auger Nano Probe
Testing techniques
  • PHI-680 FE AES
  • PHI TRIFT-II TOF-SIMS
  • JSM-6700 FE-SEM
  • Hitachi S-5200 Super-SEM
  • JSM-6301 SEM/EDX
  • JEOL JEM2100F TEM / X-24063JGT EDS / Gatan 794 EELS
  • Digital DI 3100 SPM
  • FEI-200 THP, SII SMI 3050MS2
  • Centar Next-1 TPS-4000 lapping System

AFM

Super-SEM

FIB

FE-SEM

 

Services
  • Material characterization & Surface analysis, sub-nanometer~ sub-micrometer
  • Diffusion at the interface
  • Surface Corrosion
  • Surface Dopants
  • Failure analysis
  • Morphology & Topography
  • Thin film analysis
  • Cleanliness analysis
  • Plating thickness & composition

PHI TRIFT-II TOF-SIMS